Daniel Wayne Levesque, Jr.

City:

Bath, New York

Country:

United States

Published Applications:

Last publication date:

2026-02-12

Top Assignees for applications by Daniel Wayne Levesque, Jr.

The entities that hold a legal rights for patent applications filed by inventor Levesque, Jr. Daniel Wayne:

CORNING INCORPORATED 1 Corning, NY United States

Recent patent applications by Levesque, Jr. Daniel Wayne

Daniel Wayne Levesque, Jr. from Bath, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-02-12

US20260042712A1

Chemistry; metallurgy

DEVICES HAVING THREE-DIMENSIONAL SHAPES ATTACHED TO THIN CERAMIC SUBSTRATES AND METHODS OF MAKING

#2 | 2025-05-15

US20250157812A1

Electricity

METHODS FOR FORMING THROUGH-GLASS VIAS

#3 | 2024-10-24

US20240351945A1

Chemistry; metallurgy

GLASS CERAMIC SUBSTRATE WITH THROUGH-GLASS VIA

#4 | 2016-12-15

US20160362331A1

Chemistry; metallurgy

Methods of etching glass substrates and glass substrates

InventorID:

6465727 ⎘