Hsinchu County
Taiwan
54
2026-06-18
The entities that hold a legal rights for patent applications filed by inventor CHEN Chen-Shien:
Chen-Shien CHEN from Hsinchu County, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
SEMICONDUCTOR PACKAGE AND FORMATION METHOD THEREOF
#2 | 2026-05-21SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
#3 | 2026-04-02DEVICE AND METHOD FOR PROCESSING SEMICONDUCTOR STRUCTURE
#4 | 2026-02-19SEMICONDUCTOR STRUCTURE
#5 | 2025-11-20DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
#6 | 2025-11-20PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
#7 | 2025-08-21DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
#8 | 2025-02-20SEMICONDUCTOR DEVICE
#9 | 2024-11-14METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
#10 | 2024-10-24PACKAGE ON PACKAGE STRUCTURE
#11 | 2024-05-09PACKAGE STRUCTURE HAVING A STACKED SEMICONDUCTOR DIES WITH WAVY SIDEWALLS AND METHOD OF FORMING THE SAME
#12 | 2023-11-16Package and package-on-package structure having elliptical columns and ellipsoid joint terminals
#13 | 2022-09-22Semiconductor package and method of manufacturing semiconductor package
#14 | 2022-09-22Package and package-on-package structure having elliptical columns and ellipsoid joint terminals
#15 | 2022-09-15Method of forming semiconductor device
#16 | 2022-06-02Package on package structure
#17 | 2021-01-14Method for manufacturing semiconductor package for warpage control
#18 | 2020-10-29Semiconductor devices
#19 | 2020-08-27Micro-connection structure and manufacturing method thereof
#20 | 2020-06-18Package and package-on-package structure having elliptical columns and ellipsoid joint terminals
#21 | 2020-03-19Package on package structure
#22 | 2020-01-30Semiconductor device
#23 | 2019-12-05Package structure and method of fabricating the same
#24 | 2019-12-05METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#25 | 2019-10-24Package on package structure
#26 | 2019-10-24Semiconductor device and method of forming the same
#27 | 2019-09-26Semiconductor devices and methods of forming the same
#28 | 2019-09-26Package and package-on-package structure having elliptical conductive columns
#29 | 2019-08-22Micro-connection structure and manufacturing method thereof
#30 | 2019-08-15Package structure having a plurality of conductive balls with narrow width for ball waist
#31 | 2019-07-25Semiconductor devices
#32 | 2019-05-30Semiconductor package and method for manufacturing the same
#33 | 2019-05-09Micro-connection structure and manufacturing method thereof
#34 | 2019-03-28Semiconductor devices and methods of forming the same
#35 | 2019-01-24Semicondcutor device and manufacturing method thereof
#36 | 2019-01-03Semiconductor devices and methods of forming the same
#37 | 2018-12-27Package structure having a plurality of conductive balls having narrow width for the ball waist
#38 | 2018-12-06Semiconductor devices and methods of forming the same
#39 | 2018-05-31Package structure and method of fabricating the same
#40 | 2018-05-31Semiconductor device and method of forming the same
#41 | 2017-09-28Semiconductor structure and fabricating method thereof
#42 | 2017-09-14Semiconductor device having conductive bumps of varying heights
#43 | 2017-07-27Semiconductor structure and manufacturing method of the same
#44 | 2017-05-30Semiconductor device
#45 | 2016-12-08Substrate and package structure
#46 | 2016-11-17Method for manufacturing semiconductor package structure
#47 | 2016-11-17Semiconductor package and manufacturing method of the same
#48 | 2016-06-02Semiconductor device having conductive bumps of varying heights
#49 | 2016-04-21Semiconductor package structure and manufacturing method thereof
#50 | 2016-04-21Semiconductor package and manufacturing method of the same
#51 | 2016-03-03SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#52 | 2015-08-27Substrate and package structure
#53 | 2014-02-13VARIABLE FREQUENCY MICROWAVE DEVICE AND METHOD FOR RECTIFYING WAFER WARPAGE
#54 | 2011-03-24Strong interconnection post geometry
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