Ying-Lien Chen

City:

Chiayi

Country:

Taiwan

Published Applications:

Last publication date:

2019-02-28

Top Assignees for applications by Ying-Lien Chen

The entities that hold a legal rights for patent applications filed by inventor Chen Ying-Lien:

Ying-Lien Chen from Chiayi, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Interconnect structure

Method for forming copper material over substrate

Interconnect structure and fabrication method thereof

InventorID:

6472468 ⎘