Daisuke Kawase

City:

Hitachi

Country:

Japan

Published Applications:

Last publication date:

2024-01-04

Top Assignees for applications by Daisuke Kawase

The entities that hold a legal rights for patent applications filed by inventor Kawase Daisuke:

Daisuke Kawase from Hitachi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

SEMICONDUCTOR MODULE

Semiconductor device having a stacked electrode with an electroless nickel plating layer

Semiconductor power module and power conversion apparatus using the same

InventorID:

6491205 ⎘