Yuya Okimura

City:

Nagoya

Country:

Japan

Published Applications:

Last publication date:

2022-12-29

Top Assignees for applications by Yuya Okimura

The entities that hold a legal rights for patent applications filed by inventor Okimura Yuya:

TOAGOSEI CO., LTD 3 Tokyo, Japan
TOAGOSEI CO., LTD. 1 Minato-ku, Japan
TOAGOSEI CO., LTD. 1 Minato-ku, Tokyo, Japan

Recent patent applications by Okimura Yuya

Yuya Okimura from Nagoya, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-12-29

US20220411630A1

Chemistry; metallurgy

RESIN COMPOSITION, LAYERED BODY INCLUDING RESIN COMPOSITION LAYER, LAYERED BODY, FLEXIBLE COPPER-CLAD LAMINATE, FLEXIBLE FLAT CABLE, AND ELECTROMAGNETIC WAVE SHIELDING FILM

#2 | 2017-10-19

US20170297302A1

Performing operations; transporting

Adhesive composition and laminate with adhesive layer using same

#3 | 2017-09-14

US20170259544A1

Performing operations; transporting

Adhesive layer-equipped laminate, and flexible copper-clad laminate sheet and flexible flat cable using same

#4 | 2016-08-04

US20160222192A1

Chemistry; metallurgy

Flame-retardant adhesive composition, coverlay film using same, and flexible copper-clad laminate

InventorID:

6499025 ⎘