Wei-Ray Lin

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2026-06-18

Top Assignees for applications by Wei-Ray Lin

The entities that hold a legal rights for patent applications filed by inventor Lin Wei-Ray:

Wei-Ray Lin from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

SEMICONDUCTOR PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND BONDING FAILURE TEST METHOD THEREOF

GALVANIC EFFECT MONITOR TEST STRUCTURE FOR IC PACKAGE INTERPOSER

SEMICONDUCTOR DIE AND WAFER BONDING CRACK DETECTOR STRUCTURES AND METHODS OF FORMING SAME

Overlay error and process window metrology

Overlay error and process window metrology

InventorID:

6502348 ⎘