Pius Steinmann

City:

Menznau

Country:

Switzerland

Published Applications:

Last publication date:

2019-05-02

Top Assignees for applications by Pius Steinmann

The entities that hold a legal rights for patent applications filed by inventor Steinmann Pius:

Pius Steinmann from Menznau, CH has applied for patents for these inventions. The list has both pending applications and granted patents:

Support carrier material with a modified resin layer, and the production thereof

Method and system for applying particulate solids on a substrate

Method and system for applying particulate solids on a substrate

Method and system for applying particulate solids on a substrate

InventorID:

650236 ⎘