Takumi Ejima

City:

Mie

Country:

Japan

Published Applications:

Last publication date:

2020-08-27

Top Assignees for applications by Takumi Ejima

The entities that hold a legal rights for patent applications filed by inventor Ejima Takumi:

Takumi Ejima from Mie, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Electronic module

Electronic module

Electronic module

Electrical junction box

Wiring harness connecting structure for housed circuit assembly

Wire harness connecting structure for two circuit assemblies

InventorID:

6502803 ⎘