Hirokazu Katsui

City:

Sendai

Country:

Japan

Published Applications:

Last publication date:

2019-08-15

Top Assignees for applications by Hirokazu Katsui

The entities that hold a legal rights for patent applications filed by inventor Katsui Hirokazu:

Hirokazu Katsui from Sendai, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Conductive supporting member and method for producing the same

Method for manufacturing copper alloy and copper alloy

InventorID:

6506067 ⎘