Daisuke Sawada

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2017-11-23

Top Assignees for applications by Daisuke Sawada

The entities that hold a legal rights for patent applications filed by inventor Sawada Daisuke:

Daisuke Sawada from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Seat covering material, method for manufacturing the seat covering material, and embossing roll

InventorID:

6523003 ⎘