Daisuke Maruyama

City:

Iruma

Country:

Japan

Published Applications:

Last publication date:

2024-02-29

Top Assignees for applications by Daisuke Maruyama

The entities that hold a legal rights for patent applications filed by inventor Maruyama Daisuke:

Daisuke Maruyama from Iruma, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

SOLDER ALLOY, JOINT PORTION, JOINING MATERIAL, SOLDER PASTE, JOINT STRUCTURE, AND ELECTRONIC CONTROL DEVICE

Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic device

InventorID:

6535897 ⎘