Masaru Hatabe

City:

Kobe

Country:

Japan

Published Applications:

Last publication date:

2024-08-01

Top Assignees for applications by Masaru Hatabe

The entities that hold a legal rights for patent applications filed by inventor Hatabe Masaru:

Masaru Hatabe from Kobe, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

STRUCTURE COMPRISING UNDER BARRIER METAL AND SOLDER LAYER, AND METHOD FOR PRODUCING STRUCTURE

TREATMENT METHOD AFTER PLATING WITH Sn OR Sn ALLOY

STRUCTURE CONTAINING Sn LAYER OR Sn ALLOY LAYER

Structure including copper plating layer or copper alloy plating layer

Copper or copper alloy electroplating bath

Structure containing Sn layer or Sn alloy layer

Tin or tin alloy electroplating bath, and electronic component having electrodeposit formed thereon using the plating bath

InventorID:

6545352 ⎘