Sandip Das

City:

Tsukuba

Country:

Japan

Published Applications:

Last publication date:

2020-06-18

Top Assignees for applications by Sandip Das

The entities that hold a legal rights for patent applications filed by inventor Das Sandip:

National Institute for Materials Science 1 Tsukuba, Japan

Recent patent applications by Das Sandip

Sandip Das from Tsukuba, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-06-18

US20200190378A1

Chemistry; metallurgy

Adhesive composition, a process of producing the adhesive composition, a bonding method using the adhesive composition, and a structure having the adhesive composition applied thereon

InventorID:

6560367 ⎘