Seonghun Back

City:

Jeollabuk-do

Country:

South Korea

Published Applications:

Last publication date:

2021-08-12

Top Assignees for applications by Seonghun Back

The entities that hold a legal rights for patent applications filed by inventor Back Seonghun:

JEONJU UNIVERSITY OFFICE OF INDUSTRY UNIVERSITY COOPERATION 1 Jeonju-si, South Korea
Hun Jeong 1 Jeonju-si, South Korea

Recent patent applications by Back Seonghun

Seonghun Back from Jeollabuk-do, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-08-12

US20210246558A1

Chemistry; metallurgy

Method of preparing nanocomposite material plated with network-type metal layer through silica self-cracks and wearable electronics carbon fiber prepared therefrom

InventorID:

6570413 ⎘