Daisuke Sato

City:

Moriyama

Country:

Japan

Published Applications:

Last publication date:

2020-05-07

Top Assignees for applications by Daisuke Sato

The entities that hold a legal rights for patent applications filed by inventor Sato Daisuke:

Daisuke Sato from Moriyama, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Method for curing adhesive composition and method for manufacturing bonded structure

InventorID:

6572184 ⎘