Rena Kojima

City:

Ibaraki

Country:

Japan

Published Applications:

Last publication date:

2022-04-28

Top Assignees for applications by Rena Kojima

The entities that hold a legal rights for patent applications filed by inventor Kojima Rena:

Rena Kojima from Ibaraki, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Thermosetting sheet, dicing die bonding film, and semiconductor apparatus

InventorID:

6573776 ⎘