Scott Phillips

City:

Boise, Idaho

Country:

United States

Published Applications:

Last publication date:

2025-10-09

Top Assignees for applications by Scott Phillips

The entities that hold a legal rights for patent applications filed by inventor Phillips Scott:

Scott Phillips from Boise, US has applied for patents for these inventions. The list has both pending applications and granted patents:

INTERLOCKING BUILDING PANELS

LAYERED CONSTRUCTIONS WITH REMOVABLE LAYERS

STABLE POLY(ALKYL ALDEHYDE)S

CLOSED-LOOP RECYCLING OF SCALABLE PLASTICS

CLOSED-LOOP RECYCLING OF SCALABLE PLASTICS

SUGAR-BASED COMPOSITE MATERIALS AS ALTERNATIVES TO PLASTICS

InventorID:

6582677 ⎘