Phoenix, Arizona
United States
24
2023-10-05
The entities that hold a legal rights for patent applications filed by inventor Yoder Jay A.:
Jay A. Yoder from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor package structures and methods of manufacture
#2 | 2022-03-17Semiconductor package structures and methods of manufacture
#3 | 2019-12-19Semiconductor package structures and methods of manufacture
#4 | 2018-04-05Single or multi chip module package and related methods
#5 | 2018-02-22Holes and dimples to control solder flow
#6 | 2017-04-20Single or multi chip module package and related methods
#7 | 2017-01-05Semiconductor die singulation method
#8 | 2016-03-17Single or multi chip module package and related methods
#9 | 2015-08-13Semiconductor die singulation method
#10 | 2014-05-15Semiconductor die singulation method
#11 | 2014-02-20Semiconductor die singulation method
#12 | 2011-03-24Multi-chip semiconductor connector
#13 | 2010-01-07Electronic package having down-set leads and method
#14 | 2009-12-03Method of forming a leaded molded array package
#15 | 2008-09-11Semiconductor component and method of manufacture
#16 | 2008-01-10Multi-chip semiconductor connector assemblies
#17 | 2007-06-07Multi-chip semiconductor connector assembly method
#18 | 2007-06-07Multi-chip semiconductor connector and method
#19 | 2007-05-24Semiconductor component and method of manufacture
#20 | 2007-05-17Method of forming a leaded molded array package
#21 | 2006-06-22Method of marking a low profile packaged semiconductor device
#22 | 2005-12-29Multi-chip semiconductor connector assembly method
#23 | 2005-12-29Multi-chip semiconductor connector assemblies
#24 | 2005-12-29Multi-chip semiconductor connector and method
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