Bin Liu

City:

Shenyang

Country:

China

Published Applications:

Last publication date:

2026-02-19

Recent patent applications by Liu Bin

Bin Liu from Shenyang, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

FORMING SEMICONDUCTOR CHIP PACKAGE WITH A SACRIFICAL LAYER

BALL MOUNTING APPARATUS WITH BALL ATTACH VOLUME CONTROL

IC FABRICATION FLOW WITH CONTINUOUS DYNAMIC SAMPLING FOR AUTO-VISUAL INSPECTION

InventorID:

6586298 ⎘