John HOLMES

City:

Escondido, California

Country:

United States

Published Applications:

Last publication date:

2024-10-24

Top Assignees for applications by John HOLMES

The entities that hold a legal rights for patent applications filed by inventor HOLMES John:

QUALCOMM INCORPORATED 1 San Diego, CA United States

Recent patent applications by HOLMES John

John HOLMES from Escondido, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-10-24

US20240355747A1

Electricity

SUBSTRATE WITH MULTIPLE CORE LAYERS TO PROVIDE VARIED THICKNESS CAVITIES SUPPORTING VARIED THICKNESS EMBEDDED ELECTRICAL DEVICES, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS

#2 | 2024-02-29

US20240072032A1

Electricity

PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE AND A METALLIZATION PORTION

#3 | 2024-02-29

US20240071993A1

Electricity

PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN TWO METALLIZATION PORTIONS

InventorID:

6586371 ⎘