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Inventor profile of:

Asuka KIMURA

City:

Tokyo

Country:

Japan

Published Applications:

1

Last publication date:

2024-03-07

Recent patent applications by KIMURA Asuka

Asuka KIMURA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-03-07

US20240076472A1

Chemistry; metallurgy

BIODEGRADABLE RESIN COMPOSITION AND MOLDED BODY

InventorID:

6590104 ⎘