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Inventor profile of:

BumRyul MAENG

City:

Incheon

Country:

South Korea

Published Applications:

Last publication date:

2026-05-07

Recent patent applications by MAENG BumRyul

BumRyul MAENG from Incheon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-05-07

US20260130295A1

Electricity

SEMICONDUCTOR PACKAGE AND A METHOD FOR FORMING THE SAME

#2 | 2026-01-01

US20260005103A1

Electricity

SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD FOR FORMING THE SAME

#3 | 2025-10-30

US20250336765A1

Electricity

ELECTRONIC PACKAGE ASSEMBLY WITH A COOLING SYSTEM AND A METHOD FOR FORMING THE SAME

#4 | 2025-07-10

US20250228032A1

Electricity

OMNIDIRECTIONAL SENSOR PACKAGE AND A METHOD FOR MAKING THE SAME

#5 | 2025-07-10

US20250226288A1

Electricity

SEMICONDUCTOR PACKAGE ASSEMBLY WITH AN INTERLAYER COOLING PATHWAY

#6 | 2024-12-19

US20240421172A1

Electricity

TWO-WAY OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

#7 | 2024-12-19

US20240421138A1

Electricity

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

#8 | 2024-12-05

US20240405049A1

Electricity

SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

#9 | 2024-11-21

US20240387577A1

Electricity

OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

#10 | 2024-11-21

US20240387400A1

Electricity

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

#11 | 2024-11-07

US20240371812A1

Electricity

ELECTRONIC PACKAGE AND A PACKAGING METHOD

#12 | 2024-10-31

US20240363368A1

Electricity

SENSOR PACKAGE AND METHOD FOR FORMING THE SAME

#13 | 2024-03-21

US20240096920A1

Electricity

SENSOR ASSEMBLY AND METHOD FOR FORMING THE SAME

InventorID:

6606541 ⎘