Eiji HASHINO

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2014-04-24

Top Assignees for applications by Eiji HASHINO

The entities that hold a legal rights for patent applications filed by inventor HASHINO Eiji:

Eiji HASHINO from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

INTERCONNECTOR FOR SOLAR CELLS, AND SOLAR CELL MODULE

Lead-free solder bump bonding structure

MICRO-BALL REMOVAL METHOD AND REMOVAL DEVICE, AND MICRO-BALL COLLECTIVE MOUNTING METHOD AND COLLECTIVE MOUNTING APPARATUS

Solder ball mounting method and apparatus

InventorID:

663167 ⎘