Dublin, California
United States
10
2018-05-31
The entities that hold a legal rights for patent applications filed by inventor LEE William T.:
William T. LEE from Dublin, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Interlevel conductor pre-fill utilizing selective barrier deposition
#2 | 2018-04-19Integrated direct dielectric and metal deposition
#3 | 2017-06-08Interlevel conductor pre-fill utilizing selective barrier deposition
#4 | 2016-04-28Interlevel conductor pre-fill utilizing selective barrier deposition
#5 | 2015-12-31Selective formation of dielectric barriers for metal interconnects in semiconductor devices
#6 | 2015-11-10Plated metal hard mask for vertical NAND hole etch
#7 | 2014-09-09Electroless copper deposition with suppressor
#8 | 2014-03-18Interconnect with self-formed barrier
#9 | 2014-02-27Devices for metallization
#10 | 2012-01-12Methods, devices, and materials for metallization
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