Richardson, Texas
United States
10
2015-10-15
The entities that hold a legal rights for patent applications filed by inventor Romig Matthew David:
Matthew David Romig from Richardson, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide
#2 | 2015-01-22Integrated circuit package and method
#3 | 2014-12-11Integrated circuit package with printed circuit layer
#4 | 2014-06-26Integrated circuit package with printed circuit layer
#5 | 2014-05-08Electronic assembly with three dimensional inkjet printed traces
#6 | 2014-05-08Discrete device mounted on substrate
#7 | 2014-02-27Electronic assembly with three dimensional inkjet printed traces
#8 | 2011-03-24Method for connecting integrated circuit chip to power and ground circuits
#9 | 2010-11-18WAFER CHIP SCALE PACKAGE WITH CENTER CONDUCTIVE MASS
#10 | 2008-11-20Apparatus for connecting integrated circuit chip to power and ground circuits
663199 ⎘