Michael Bourbina

City:

Midland, Michigan

Country:

United States

Published Applications:

Last publication date:

2014-02-27

Top Assignees for applications by Michael Bourbina

The entities that hold a legal rights for patent applications filed by inventor Bourbina Michael:

Michael Bourbina from Midland, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Wafer bonding system and method for bonding and debonding thereof

InventorID:

666475 ⎘