Ryo Ishikawa

City:

Saga

Country:

Japan

Published Applications:

Last publication date:

2022-04-21

Top Assignees for applications by Ryo Ishikawa

The entities that hold a legal rights for patent applications filed by inventor Ishikawa Ryo:

TANAKA DENSHI KOGYO K. K. 1 Kanzaki-gun, Japan

Recent patent applications by Ishikawa Ryo

Ryo Ishikawa from Saga, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-04-21

US20220122937A1

Electricity

Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, semiconductor device using the same, and manufacturing method thereof

InventorID:

6669999 ⎘