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Inventor profile of:

Eric Wu

City:

Shenzhen

Country:

China

Published Applications:

1

Last publication date:

2024-05-30

Recent patent applications by Wu Eric

Eric Wu from Shenzhen, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-05-30

US20240178103A1

Chip Stacked Structure and Manufacturing Method Thereof, Chip Package Structure, and Electronic Device

InventorID:

6674734 ⎘