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Inventor profile of:

Mitsuhiro SAKUMA

City:

Nagano

Country:

Japan

Published Applications:

1

Last publication date:

2024-05-30

Recent patent applications by SAKUMA Mitsuhiro

Mitsuhiro SAKUMA from Nagano, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-05-30

US20240178118A1

PACKAGE SUBSTRATE AND SEMICONDUCTOR DEVICE

InventorID:

6674740 ⎘