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Inventor profile of:

Jianjun SHU

City:

Beijing

Country:

China

Published Applications:

1

Last publication date:

2024-06-06

Recent patent applications by SHU Jianjun

Jianjun SHU from Beijing, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-06-06

US20240183627A1

Mechanical engineering

CONNECTOR, CONNECTOR ASSEMBLY, LIQUID COOLED PLATE, AND LIQUID COOLED SERVER

InventorID:

6679596 ⎘