🔗 Permalink

Inventor profile of:

Holger KUHNERT

City:

München

Country:

Germany

Published Applications:

1

Last publication date:

2024-06-13

Recent patent applications by KUHNERT Holger

Holger KUHNERT from München, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-06-13

US20240196520A1

PRINTED CIRCUIT BOARD WITH ELECTROMAGNETIC BANDGAP STRUCTURE FOR LAUNCHER IN PACKAGE DEVICES

InventorID:

6689570 ⎘