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Inventor profile of:

Daniel DURMEK

City:

BRATISLAVA

Country:

Slovak Republic

Published Applications:

1

Last publication date:

2024-06-20

Recent patent applications by DURMEK Daniel

Daniel DURMEK from BRATISLAVA, SK has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-06-20

US20240198565A1

Performing operations; transporting

PACKING STRUCTURE AND PREPARATION DEVICE THEREOF, ENCAPSULATION MOLD AND VEHICLE WINDOW ASSEMBLY

InventorID:

6691944 ⎘