Emre Topal

City:

Munchen

Country:

Germany

Published Applications:

Last publication date:

2025-06-19

Recent patent applications by Topal Emre

Emre Topal from Munchen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

PACKAGING FOR MICRO-ELECTROMECHANICAL SYSTEM (MEMS) DEVICE

DIE PACKAGE WITH GUARD STRUCTURE TO REDUCE OR PREVENT MATERIAL SEEPAGE INTO AIR CAVITY, AND RELATED FABRICATION METHODS

INTEGRATED BARE DIE PACKAGE, AND RELATED FABRICATION METHODS

InventorID:

6696466 ⎘