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Inventor profile of:

Seongho Oh

City:

Suwon-si

Country:

Korea (South)

Published Applications:

1

Last publication date:

2024-06-20

Recent patent applications by Oh Seongho

Seongho Oh from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-06-20

US20240204027A1

WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME

InventorID:

6696501 ⎘