Jonathan ATKINS

City:

Phoenix, Arizona

Country:

United States

Published Applications:

Last publication date:

2024-06-27

Recent patent applications by ATKINS Jonathan

Jonathan ATKINS from Phoenix, US has applied for patents for these inventions. The list has both pending applications and granted patents:

TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS

InventorID:

6704333 ⎘