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Inventor profile of:

Junxing Gu

City:

Shanghai

Country:

China

Published Applications:

1

Last publication date:

2024-07-04

Recent patent applications by Gu Junxing

Junxing Gu from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-07-04

US20240222367A1

Three-Dimensional Memory, Chip Package Structure, and Electronic Device

InventorID:

6712302 ⎘