Wayne Meyer

City:

Cheney, Washington

Country:

United States

Published Applications:

Last publication date:

2026-02-12

Top Assignees for applications by Wayne Meyer

The entities that hold a legal rights for patent applications filed by inventor Meyer Wayne:

Wayne Meyer from Cheney, US has applied for patents for these inventions. The list has both pending applications and granted patents:

MECHANICAL LOCKING SPUTTERING TARGET BONDING METHOD AND TARGET ASSEMBLIES PRODUCED THEREBY

DIFFUSION BONDED TUNGSTEN CONTAINING TARGET TO TITANIUM OR TITANIUM ALLOY BACKING PLATE

DIFFUSION BONDED TUNGSTEN CONTAINING TARGET TO COPPER ALLOY BACKING PLATE

InventorID:

6716845 ⎘