Charles David Paynter

INTEGRATED DEVICE SUBSTRATE INCLUDING EMBEDDED ELECTROMAGNETIC ISOLATION STRUCTURE

PACKAGE COMPRISING INTEGRATED DEVICES AND A PASSIVE DEVICE

PACKAGE COMPRISING A SUBSTRATE WITH AN EMBEDDED FRAME

STACKED INTEGRATED CIRCUIT DEVICES

Providing a lower inductance path in a routing substrate for a capacitor, and related electronic devices and fabrication methods

PACKAGE WITH A SUBSTRATE COMPRISING EMBEDDED STACKED TRENCH CAPACITOR DEVICES

PACKAGE COMPRISING INTEGRATED DEVICES

Package comprising channel interconnects located between solder interconnects

Package comprising integrated devices coupled through a metallization layer

Patch substrate configured as a shield located over a cavity of a board

Package comprising a substrate and a high-density interconnect integrated device coupled to the substrate

SUBSTRATE-EMBEDDED SUBSTRATE

Toroid inductor with reduced electromagnetic field leakage

Integrated circuit (IC) module comprising an integrated circuit (IC) package and an interposer with embedded passive components

Systems and methods for thermal dissipation

CUSTOM ORIENTATION OF SOCKET PINS TO ACHIEVE HIGH ISOLATION BETWEEN CHANNELS WITHOUT ADDING EXTRA REFERENCE PINS

Staggered power structure in a power distribution network (PDN)

Apparatus and methods for shielding differential signal pin pairs

Inductor embedded in a package substrate

Package on package (PoP) integrated device comprising a redistribution layer

Method and apparatus for routing die signals using external interconnects