Mountain View, California
United States
58
2025-04-10
The entities that hold a legal rights for patent applications filed by inventor Salmon Peter C.:
Peter C. Salmon from Mountain View, US has applied for patents for these inventions. The list has both pending applications and granted patents:
DENSELY PACKED ELECTRONIC SYSTEMS
#2 | 2025-03-18Water-cooled electronic system
#3 | 2025-03-13HERMETIC MICROELECTRONIC MODULE USING A SHEATH
#4 | 2024-11-05Microelectronic module
#5 | 2024-05-16ZETTASCALE Supercomputer
#6 | 2023-08-31WATER COOLED SERVER
#7 | 2023-03-23Densely packed electronic systems
#8 | 2022-12-06Water cooled server
#9 | 2022-07-07Densely packed electronic systems
#10 | 2021-11-04Densely packed electronic systems
#11 | 2019-08-15Programmable charge storage arrays and associated manufacturing devices and systems
#12 | 2019-03-07Programmable charge storage arrays and associated manufacturing devices and systems
#13 | 2018-09-25Method and system for deploying a flexible device
#14 | 2018-04-19SYSTEM OF STACKED DEVICES
#15 | 2017-09-12Method and system for manufacturing using a programmable patterning structure
#16 | 2017-08-03METHOD AND SYSTEM FOR SMART CONTACT ARRAYS
#17 | 2017-07-20MAGNETIC COUPLING DEVICE
#18 | 2016-04-07Magnetic contacting array
#19 | 2016-04-07RELEASABLE MAGNETIC DEVICE
#20 | 2016-01-05Method for patterning materials on a substrate
#21 | 2015-07-16System of stacked devices
#22 | 2015-03-12Snap on wearable module
#23 | 2015-02-10Self-winding membrane device
#24 | 2014-12-30Display cartridge, systems and devices
#25 | 2014-08-28System of stacked devices
#26 | 2014-03-06System of stacked devices
#27 | 2014-03-06Method and system for smart contact arrays
#28 | 2014-03-06Electronic system modules and method of fabrication
#29 | 2012-03-01RETRACTABLE DEVICE
#30 | 2010-11-25Electronic system modules and method of fabrication
#31 | 2010-01-14Electronic assembly with electronic compontent and interconnection assembly connected via conductive bump and mating well
#32 | 2009-10-01Electronic system modules and method of fabrication
#33 | 2009-08-06SCALABLE SUBSYSTEM ARCHITECTURE HAVING INTEGRATED COOLING CHANNELS
#34 | 2009-07-30APPARATUS AND METHOD FOR TESTING ELECTRONIC SYSTEMS
#35 | 2009-03-17Apparatus and method for testing electronic systems
#36 | 2008-08-19Apparatus and method for deploying an information retrieval system
#37 | 2008-04-03ELECTRONIC SYSTEM MODULES AND METHOD OF FABRICATON
#38 | 2008-02-14Electronic printing press
#39 | 2008-01-31Electronic system modules and method of fabrication
#40 | 2007-11-20Fabrication method for electronic system modules
#41 | 2007-10-25Fabrication method for electronic system modules
#42 | 2007-02-01Scalable subsystem architecture having integrated cooling channels
#43 | 2007-02-01Flip chip interface including a mixed array of heat bumps and signal bumps
#44 | 2007-02-01Electro-optic interconnection apparatus and method
#45 | 2007-02-01Copper substrate with feedthroughs and interconnection circuits
#46 | 2007-01-11Semiconductor wafer tester
#47 | 2006-09-28Energy converter utilizing electrostatics
#48 | 2006-07-06Wafer level test head
#49 | 2006-06-22Repairable three-dimensional semiconductor subsystem
#50 | 2006-05-18Tiled construction of layered materials
#51 | 2006-04-13Method for temporarily engaging electronic component for test
#52 | 2006-04-13Adaptive interface using flexible fingers
#53 | 2005-11-17Micro blade assembly
#54 | 2005-11-17Cooling apparatus and method
#55 | 2005-08-25System in package
#56 | 2005-08-25Imprinting tools and methods for printed circuit boards and assemblies
#57 | 2005-04-19Component connections using bumps and wells
#58 | 2005-02-24Interconnection circuit and electronic module utilizing same
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