Radebeul
Germany
29
2013-01-31
The entities that hold a legal rights for patent applications filed by inventor Feudel Thomas:
Thomas Feudel from Radebeul, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Methods for fabricating integrated circuits using non-oxidizing resist removal
#2 | 2012-06-14Technique for enhancing dopant profile and channel conductivity by millisecond anneal processes
#3 | 2011-11-03Reduced STI loss for superior surface planarity of embedded stressors in densely packed semiconductor devices
#4 | 2011-09-08Technique for enhancing transistor performance by transistor specific contact design
#5 | 2011-05-26Technique for enhancing dopant profile and channel conductivity by millisecond anneal processes
#6 | 2010-09-23Reducing transistor junction capacitance by recessing drain and source regions
#7 | 2009-12-01Semiconductor device having improved halo structures and a method of forming the halo structures of a semiconductor device
#8 | 2009-02-05Method of forming a semiconductor structure comprising an implantation of ions of a non-doping element
#9 | 2009-01-01Reducing transistor junction capacitance by recessing drain and source regions
#10 | 2008-12-04METHOD OF FORMING A SEMICONDUCTOR STRUCTURE COMPRISING AN IMPLANTATION OF IONS IN A MATERIAL LAYER TO BE ETCHED
#11 | 2008-10-30Enhancing transistor characteristics by a late deep implantation in combination with a diffusion-free anneal process
#12 | 2008-10-30TECHNIQUE FOR ENHANCING DOPANT ACTIVATION BY USING MULTIPLE SEQUENTIAL ADVANCED LASER/FLASH ANNEAL PROCESSES
#13 | 2008-10-30Technique for enhancing transistor performance by transistor specific contact design
#14 | 2008-04-03Technique for locally adapting transistor characteristics by using advanced laser/flash anneal techniques
#15 | 2008-03-06Transistor having a locally provided metal silicide region in contact areas and a method of forming the transistor
#16 | 2007-12-06METHOD OF INCREASING TRANSISTOR PERFORMANCE BY DOPANT ACTIVATION AFTER SILICIDATION
#17 | 2007-10-04METHOD FOR FORMING ULTRA-SHALLOW HIGH QUALITY JUNCTIONS BY A COMBINATION OF SOLID PHASE EPITAXY AND LASER ANNEALING
#18 | 2007-10-04Method for manufacturing semiconductor device comprising SOI transistors and bulk transistors
#19 | 2006-05-04CMOS gate structure comprising predoped semiconductor gate material with improved uniformity of dopant distribution and method of forming the structure
#20 | 2006-03-02Transistor having an asymmetric source/drain and halo implantation region and a method of forming the same
#21 | 2005-08-04Method of depositing a layer of a material on a substrate
#22 | 2005-08-02Semiconductor device having improved doping profiles and method of improving the doping profiles of a semiconductor device
#23 | 2005-06-14Diode structure for SOI circuits
#24 | 2005-05-24Methods of forming a transistor having a recessed gate electrode structure
#25 | 2005-05-12Drain/source extension structure of a field effect transistor including doped high-k sidewall spacers
#26 | 2005-03-03Technique for adjusting a penetration depth during the implantation of ions into a semiconductor region
#27 | 2005-02-03Field effect transistor having a doped gate electrode with reduced gate depletion and method of forming the transistor
#28 | 2005-02-01Methods of forming drain/source extension structures of a field effect transistor using a doped high-k dielectric layer
#29 | 2005-01-25Semiconductor device having improved doping profiles and a method of improving the doping profiles of a semiconductor device
67234 ⎘