Stamford, Connecticut
United States
5
2025-11-20
The entities that hold a legal rights for patent applications filed by inventor Kumar Arvind:
Arvind Kumar from Stamford, US has applied for patents for these inventions. The list has both pending applications and granted patents:
ELECTRONIC STRUCTURE INCLUDING DIE WITH BACKSIDE POWER DELIVERY
#2 | 2025-11-06THROUGH-CHIP VIAS EXTENDING THROUGH MULTIPLE CHIPS FOR TOP-DOWN POWER REDISTRIBUTION
#3 | 2025-01-16THREE-DIMENSIONAL CHIP OR WAFER STACK
#4 | 2025-01-02CHIPLET ARCHITECTURE FOR INFERENCE, FINE-TUNING TRAINING, AND TRANSFER LEARNING
#5 | 2024-07-25FACILITATOR DIES FOR HETEROGENEOUS DIE STACKS
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