Hodaka TABEI

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2024-08-01

Top Assignees for applications by Hodaka TABEI

The entities that hold a legal rights for patent applications filed by inventor TABEI Hodaka:

Hodaka TABEI from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

THERMOPLASTIC RESIN COMPOSITION, COMMUNICATION DEVICE MEMBER, AND MICROWAVE AND/OR MILLIMETER WAVE COMMUNICATION DEVICE

InventorID:

6735105 ⎘