Teruhiro AIKYO

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2025-05-01

Top Assignees for applications by Teruhiro AIKYO

The entities that hold a legal rights for patent applications filed by inventor AIKYO Teruhiro:

Teruhiro AIKYO from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

INORGANIC POWDER

SILICA POWDER IN WHICH AGGREGATION IS REDUCED, RESIN COMPOSITION, AND SEMICONDUCTOR SEALING MATERIAL

InventorID:

6735116 ⎘