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Inventor profile of:

Daisuke ITAKURA

City:

Shiga

Country:

Japan

Published Applications:

1

Last publication date:

2024-08-01

Recent patent applications by ITAKURA Daisuke

Daisuke ITAKURA from Shiga, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-08-01

US20240256739A1

MOLDING ANALYSIS METHOD, PROGRAM, AND RECORDING MEDIUM

InventorID:

6737248 ⎘