Pradeep Kumar Subrahmanyan

SUBSTRATE CHUCKING WITH MULTISCALE WAFER STRESS MODULATION

CHUCKING OF HIGH-WARP SUBSTRATES USING MULTIZONAL CHUCKS

MULTICHANNEL SHOWERHEAD FOR PROCESSING CHAMBERS

LOCAL DEFORMATION AND STRESS CONTROL IN DEVICE MANUFACTURING

MITIGATION OF SUBSTRATE DEFORMATION IN DEVICE MANUFACTURING USING MACHINE LEARNING SYSTEMS AND TECHNIQUES

MULTISCALE CONTROL OF SUBSTRATE DEFORMATION IN DEVICE MANUFACTURING

CONTROL OF SUBSTRATE DEFORMATION DURING MANUFACTURING PROCESSES

DEFORMATION CONTROL FOR DIE-TO-WAFER AND DIE-TO-DIE BONDING IN DEVICE MANUFACTURING

UNIFICATION OF BACKSIDE STRESS MITIGATION WITH FRONTSIDE PROTECTION IN SEMICONDUCTOR MANUFACTURING PROCESSING

DEFORMATION CONTROL OF MANUFACTURING DEVICES USING FRONT-SIDE IRRADIATION

INFLUENCE FUNCTION-BASED MITIGATION OF SUBSTRATE DEFORMATION WITH FILM DEPOSITION AND ION IMPLANTATION

CYLINDRIC DECOMPOSITION FOR EFFICIENT MITIGATION OF SUBSTRATE DEFORMATION WITH FILM DEPOSITION AND ION IMPLANTATION

OPTIMIZED FILM DEPOSITION AND ION IMPLANTATION FOR MITIGATION OF STRESS AND DEFORMATION IN SUBSTRATES

STRESS MANAGEMENT FOR PRECISE SUBSTRATE -TO- SUBSTRATE BONDING

MITIGATION OF SADDLE DEFORMATION OF SUBSTRATES USING FILM DEPOSITION AND EDGE ION IMPLANTATION