Meng MEI

City:

Beijing

Country:

China

Published Applications:

Last publication date:

2026-02-19

Recent patent applications by MEI Meng

Meng MEI from Beijing, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

TOPOLOGICAL STRUCTURE FOR IP CORE, AND IP CORE

CHIP AND METHOD FOR FORMING THE SAME, AND PACKAGE STRUCTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

InventorID:

6745348 ⎘