Josef Ehgartner

City:

Munich

Country:

Germany

Published Applications:

Last publication date:

2021-12-23

Top Assignees for applications by Josef Ehgartner

The entities that hold a legal rights for patent applications filed by inventor Ehgartner Josef:

Josef Ehgartner from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Micro-acoustic wafer-level package and method of manufacture

InventorID:

6759988 ⎘