Osaka
Japan
14
2024-05-30
The entities that hold a legal rights for patent applications filed by inventor HIRAI Bunta:
Bunta HIRAI from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
MEMBER SUPPLYING SHEET
#2 | 2022-08-25Protective cover member and member supplying sheet including the same
#3 | 2021-06-10Waterproof sound-transmitting member and electronic device provided therewith
#4 | 2021-03-25Waterproof member and electronic device
#5 | 2021-03-04Waterproof member and electronic device
#6 | 2018-02-01WATERPROOF SOUND TRANSMISSON STRUCTURE, AND ELECTRONIC DEVICE AND ELECTRONIC DEVICE CASE INCLUDING SAME
#7 | 2018-01-18Acoustic resistor, acoustic resistor member including same, and audio device including same
#8 | 2014-09-25ETHYLENE-PROPYLENE-DIENE RUBBER FOAMED MATERIAL AND SEALING MATERIAL
#9 | 2014-09-25BUFFER MATERIAL AND SEALING MATERIAL
#10 | 2014-09-25VIBRATION-PROOF MATERIAL, VIBRATION-PROOF STRUCTURE, AND VIBRATION-PROOF METHOD
#11 | 2014-08-28SOUND INSULATING MATERIAL AND SEALING MATERIAL
#12 | 2014-08-21SOUND ABSORBING MATERIAL AND SEALING MATERIAL
#13 | 2014-03-06ETHYLENE-PROPYLENE-DIENE RUBBER FOAMED MATERIAL, PRODUCING METHOD THEREOF, AND SEALING MATERIAL
#14 | 2014-03-06ETHYLENE-PROPYLENE-DIENE RUBBER FOAMED MATERIAL AND SEALING MATERIAL
676543 ⎘