So NAKAURA

City:

Wako

Country:

Japan

Published Applications:

Last publication date:

2024-09-12

Top Assignees for applications by So NAKAURA

The entities that hold a legal rights for patent applications filed by inventor NAKAURA So:

So NAKAURA from Wako, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

MODULAR PANEL SYSTEM, KIT, AND METHOD

REMOVABLE COUPLING DEVICE AND METHOD FOR COUPLNG PANELS

COUPLING DEVICE AND METHOD FOR COUPLING PANELS

WRAP DEVICE FOR MODULAR PANEL SYSTEM AND WRAPPING METHOD

FRAME STRUCTURE

InventorID:

6772435 ⎘