Junta Inoue

City:

Sanda-shi

Country:

Japan

Published Applications:

Last publication date:

2025-01-02

Top Assignees for applications by Junta Inoue

The entities that hold a legal rights for patent applications filed by inventor Inoue Junta:

MITSUBISHI MATERIALS CORPORATION 1 Tokyo, Japan
MITSUBISHI MATERIALS CORPORATION 1 Tokyo, China

Recent patent applications by Inoue Junta

Junta Inoue from Sanda-shi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-01-02

US20250003102A1

Chemistry; metallurgy

ACIDIC ELECTROLYTIC COPPER PLATING LIQUID, METHOD FOR FORMING PREFORM LAYER, METHOD FOR PRODUCING JOINING SHEET, METHOD FOR PRODUCING JOINING SUBSTRATE, AND METHOD FOR PRODUCING JOINED BODY

#2 | 2024-09-12

US20240300215A1

Performing operations; transporting

BONDING SHEET WITH PREFORM LAYER, METHOD FOR MANUFACTURING BONDED BODY, AND TO-BE-BONDED MEMBER WITH PREFORM LAYER

InventorID:

6773608 ⎘